Smarter Dispensing Solutions

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APTURA

K&S’s next generation of TCB solution, the latest APTURA™ series, offers the first-of-its-kind “fluxless bonding”, enabling direct Cu-to-Cu and bumpless bonding. 

News

Discover recent K&S news and stories.

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Kulicke & Soffa Reports Second Quarter 2025 Results May 06, 2025
Kulicke & Soffa Schedules Second Quarter 2025 Conference Call for 8:00 AM ET, May 7th, 2025 Apr 22, 2025
Kulicke & Soffa Introduces Asterion®-PW for Power Semiconductor Applications Mar 25, 2025

Events

See a list of our upcoming trade show and seminar events around the world.

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Gaylord Texan Resort & Convention Center,
Denver, CO, USA
May 28 - May 29, 2025
Trade Show
Suburban Collection Showplace,
Novi, Michigan
US
Jun 24 - Jun 26, 2025
Trade Show
Yashobhoomi (IICC), New Delhi
Sep 01 - Sep 03, 2025
Trade Show

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